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Several research studies have investigated the degradation of BaTiO3-based dielectric capacitor materials, focusing on the impact of composition, defect chemistry, and microstructural design to limit the electromigration of oxygen vacancies under electric fields at finite temperatures. Electromigration can be a dominant mechanism that controls failure rates in the individual multilayer ceramic capacitor (MLCC) components in testing the reliability of failures with highly accelerated lifetime testing (HALT) to determine the mean time to failure of MLCCs surface mounted onto printed circuit boards (PCBs). Conventional assumptions often consider these failures as independent, with no interaction between components on the PCB. However, this study employs a Physics of Failure (PoF) approach to closely examine transient degradation and its impact on MLCC reliability, emphasizing thermal crosstalk and its influence on dependent and independent failure rates. Finite element analysis thermal modeling and infrared thermography were used to assess the impact of circuit layout and component spacing on heat dissipation and thermal crosstalk under various electrical stress conditions. The study distinguishes between dependent and independent failures under a HALT, quantified through a β′ factor reflecting common cause failures due to thermal crosstalk. Through a series of experimental and statistical analyses, the β′ factor is evaluated with respect to temperature, voltage, and component spacing. These insights highlight the importance of understanding the nature of the data in reliability testing of MLCCs and optimizing the layout design of high-density circuits to mitigate dependent failures, improving overall reliability and informing better design and packaging strategies. 

Recent band structure calculations have suggested the potential for band tuning in the chiral semiconductor Ag3AuTe2 to zero upon application of negative strain. In this study, we report on the synthesis of polycrystalline Ag3AuTe2 and investigate its transport and optical properties and mechanical compressibility. Transport measurements reveal the semiconducting behavior of Ag3AuTe2 with high resistivity and an activation energy Ea of 0.2 eV. The optical bandgap determined by diffuse reflectance measurements is about three times wider than the experimental Ea. Despite the difference, both experimental gaps fall within the range of predicted bandgaps by our first-principles density functional theory (DFT) calculations employing the Perdew–Burke–Ernzerhof and modified Becke–Johnson methods. Furthermore, our DFT simulations predict a progressive narrowing of the bandgap under compressive strain, with a full closure expected at a strain of −4% relative to the lattice parameter. To evaluate the feasibility of gap tunability at such substantial strain, the high-pressure behavior of Ag3AuTe2 was investigated by in situ high-pressure x-ray diffraction up to 47 GPa. Mechanical compression beyond 4% resulted in a pressure-induced structural transformation, indicating the possibility of substantial gap modulation under extreme compression conditions. 

As the field of exfoliated van der Waals electronics grows to include complex heterostructures, the variety of available in-plane symmetries and geometries becomes increasingly valuable. In this work, we present an efficient chemical vapor transport synthesis of NbSe2I2 with the triclinic space group P1̅. This material contains Nb–Nb dimers and an in-plane crystallographic angle γ = 61.3°. We show that NbSe2I2 can be exfoliated down to few-layer and monolayer structures and use Raman spectroscopy to test the preservation of the crystal structure of exfoliated thin films. The crystal structure was verified by single-crystal and powder X-ray diffraction methods. Density functional theory calculations show triclinic NbSe2I2 to be a semiconductor with a band gap of around 1 eV, with similar band structure features for bulk and monolayer crystals. The physical properties of NbSe2I2 have been characterized by transport, thermal, optical, and magnetic measurements, demonstrating triclinic NbSe2I2 to be a diamagnetic semiconductor that does not exhibit any phase transformation below room temperature. 

The ultra-wide bandgap (UWBG) energy (∼5.4 eV) of α-phase Ga2O3 offers the potential to achieve higher power switching performance and efficiency than today's power electronic devices. However, a major challenge to the development of the α-Ga2O3 power electronics is overheating, which can degrade the device performance and cause reliability issues. In this study, thermal characterization of an α-Ga2O3 MOSFET was performed using micro-Raman thermometry to understand the device self-heating behavior. The α-Ga2O3 MOSFET exhibits a channel temperature rise that is more than two times higher than that of a GaN high electron mobility transistor (HEMT). This is mainly because of the low thermal conductivity of α-Ga2O3 (11.9 ± 1.0 W/mK at room temperature), which was determined via laser-based pump-probe experiments. A hypothetical device structure was constructed via simulation that transfer-bonds the α-Ga2O3 epitaxial structure over a high thermal conductivity substrate. Modeling results suggest that the device thermal resistance can be reduced to a level comparable to or even better than those of today's GaN HEMTs using this strategy combined with thinning of the α-Ga2O3 buffer layer. The outcomes of this work suggest that device-level thermal management is essential to the successful deployment of UWBG α-Ga2O3 devices. 

Gallium nitride (GaN) high electron mobility transistors (HEMTs) are key components of modern radio frequency (RF) power amplifiers. However, device self-heating negatively impacts both the performance and reliability of GaN HEMTs. Accordingly, laser-based pump-probe methods have been used to characterize the thermal resistance network of epitaxial material stacks that are used to fabricate HEMT structures. However, validation studies of these measurement results at the device level are lacking. In the present work, a GaN-on-SiC wafer was characterized using frequency-domain thermoreflectance and steady-state thermoreflectance techniques. The thermal conductivity of the GaN channel/buffer layer, SiC substrate, and the interfacial thermal boundary resistance at the GaN/SiC interface were determined. Results were validated by performing thermal imaging and modeling of a transmission line measurement (TLM) structure fabricated on the GaN-on-SiC wafer.